Electronic Manufacturing Services

 
X-ray inspection system
  X-ray inspection system  
In addition to visual inspection of printed circuit boards by its highly qualified staff, ELPACK also uses powerful tools to test its products and monitor its processes .
     

These tools include a high-energy and high-resolution 2D X-ray inspection system. This device is designed to detect faults, such as short circuits, beneath the ball grid array components and to view any cavities that may exist in the BGA solder joints.

 
Flying probe tester
  Flying probe tester  

For the testing of boards manufactured in small volumes, ELPACK uses a TAKAYA APT9401 flying probe tester. The conventional electrical measurement functions using measurement probes are supplemented by an optical recognition system that checks the presence, polarity and marking of components.

 
Testeur In Situ
  Flying probe tester  
  For larger quantities, ELPACK acquired in 2008, a TERADYNE TestStation LH124 In Circuit Test system, configured with 1280 test pins. This ICT equipment features safetest protection technology for accurate, reliable and safe testing of today’s new low-voltage technologies (down to 0,8V).
 
           
    COMPANY: About ELPACK - Strategy - Quality policy - Process control / OUR SKILLS: Our teams - Automated assembly - Lead-free soldering - Inspection / testing / FINAL ASSEMBLY & TEST: Introduction to PHAREL - About PHAREL - Organization - Means of production / CONTACT US  
   
ELPACK 11, rue Henri Barbusse 26000 VALENCE, France
Phone: 33 4 75 82 63 70 - Fax: 33 4 75 82 63 71- e-mail: point-entree@elpack.fr
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